US Patent Issued to Intel on Sept. 22 for "Microelectronic assembly having antiferromagnetic film structure therein" (American, Chilean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,648, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assembly having antiferromagnetic film structure therein" was invented by Srinivas V. Pietambaram (Chandler, Ariz.), Claudio A. Alvarez Barros (Santiago, Chile), Beomseok Choi (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Jeremy D. Ecton (Gilbert, Ariz.), Brandon Christian Marin (Gilbert, Ariz.), Suddhasattwa Nad (Chandler, Ariz.) and Hiroki Tanaka (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure, a semiconductor package, an IC device assembly, and a method. The structure includes a core layer including an electri...