US Patent Issued to Intel on Sept. 1 for "Fine bump pitch die to die tiling incorporating an inverted glass interposer" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,490, issued on Sept. 1, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fine bump pitch die to die tiling incorporating an inverted glass interposer" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Brandon C. Marin (Gilbert, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Suddhasattwa Nad (Chandler, Ariz.) and Leonel Arana (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a first layer comprising glass. In an embodiment, conductive pillars are formed through the first layer, and...