US Patent Issued to Intel on Oct. 6 for "TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,761, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process" was invented by Minglu Liu (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Liang He (Chandler, Ariz.), Ziyin Lin (Chandler, Ariz.), Elizabeth Nofen (Phoenix), Yiqun Bai (Chandler, Ariz.), Jonathan Atkins (Phoenix), Jesus S. Nieto Pescador (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.) and Kristof Darmawikarta (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an electronic package. In an embodime...