US Patent Issued to Intel on Oct. 6 for "Integrated circuit (IC) device with hybrid metal layer" (Oregon Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,708, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit (IC) device with hybrid metal layer" was invented by June Choi (Portland, Ore.), Charles Henry Wallace (Portland, Ore.), Richard E. Schenker (Portland, Ore.) and Nikhil Jasvant Mehta (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC device includes a transistor, a first layer, and a second layer. The first layer is coupled to the transistors and is between the transistor and the second layer in a first direction. The first layer includes a first structure and a second structure. The first structure includes a first metal (e.g., Ru). The se...