US Patent Issued to Intel on Oct. 6 for "Copper rings for BGA count reduction in small form factor packages" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,801, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Copper rings for BGA count reduction in small form factor packages" was invented by Kavitha Nagarajan (Bangalore, India), Min Suet Lim (Gelugor, Malaysia), Eng Huat Goh (Ayer Itam, Malaysia), Telesphor Kamgaing (Chandler, Ariz.), Chee Kheong Yoon (Bayan Lepas, Malaysia), Jooi Wah Wong (Bukit Mertajam, Malaysia) and Chu Aun Lim (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodim...