US Patent Issued to Intel on Oct. 6 for "Asymmetrical dielectric-to-metal adhesion architecture for electronic packages" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,760, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Asymmetrical dielectric-to-metal adhesion architecture for electronic packages" was invented by Suddhasattwa Nad (Chandler, Ariz.), Yi Yang (Gilbert, Ariz.), Jason Steill (Phoenix) and Jieying Kong (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package comprises a substrate with a first side and a second side opposite the first side; a first conductive feature on the first side and having a first surface; a first dielectric material in contact with the first surface, wherein the first dielectric material has a first composition comprising ...