US Patent Issued to Intel on Oct. 27 for "Double-decked interconnect features" (Oregon Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,912, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Double-decked interconnect features" was invented by June Choi (Portland, Ore.), Richard Schenker (Portland, Ore.), Charles H. Wallace (Portland, Ore.), Nikhil J. Mehta (Portland, Ore.) and Clifford L. Ong (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a first interconnect layer, and a second interconnect layer above the first interconnect layer. The first interconnect layer includes a first interconnect feature and a second interconnect feature. The second interconnect layer includes a third interconnect feature, a fo...