ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,798, issued on Oct. 20, was assigned to Intel Corp. (Santa Clara, Calif.).
"Thin film capacitors" was invented by Mahdi Mohammadighaleni (Phoenix), Benjamin Duong (Phoenix), Shayan Kaviani (Phoenix), Joshua Stacey (Chandler, Ariz.), Miranda Ngan (Chandler, Ariz.), Dilan Seneviratne (Chandler, Ariz.), Thomas Heaton (Mesa, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.), Whitney Bryks (Chandler, Ariz.) and Jieying Kong (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) are provided. A 3D TFC can include a glass core, a through gla...