US Patent Issued to Intel on Nov. 3 for "Self-aligned air gap formation in microelectronics packages" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,780,648, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Self-aligned air gap formation in microelectronics packages" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Brandon C. Marin (Gilbert, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.), Oladeji Fadayomi (Maricopa, Ariz.) and Oscar Ojeda (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronics package architectures having self-aligned air gaps and methods of manufacturing the same. The microelectronics packages may include first and second substrates, first and second traces, and a photosensitive material. The first ...