US Patent Issued to Intel on Nov. 3 for "On package interconnect architecture for high-speed memory" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,751, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"On package interconnect architecture for high-speed memory" was invented by Jooi Wah Wong (Bukit Mertajam, Malaysia), Eng Huat Goh (Ayer Itam, Malaysia), Telesphor Kamgaing (Chandler, Ariz.), Chee Kheong Yoon (Bayan Lepas, Malaysia), Min Suet Lim (Gelugor, Malaysia), Kavitha Nagarajan (Bangalore, India) and Chu Aun Lim (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include package substrates. In an embodiment, a package substrate comprises a core, a first layer on the core, where the first layer comprises a first plane, a second la...