US Patent Issued to Intel on Nov. 3 for "Methods and apparatus to reduce impedance discontinuities and crosstalk in integrated circuit packages" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,825, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to reduce impedance discontinuities and crosstalk in integrated circuit packages" was invented by Chenghai Yan (Shanghai), Lei Wang (Shanghai), Maoxin Yin (Shanghai) and Wenzhi Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. A disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. The ball grid array includes a first ball and a s...