US Patent Issued to Intel on Nov. 3 for "Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,743, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members" was invented by Zhenguo Jiang (Chandler, Ariz.), Zhiguo Qian (Chandler, Ariz.), Jiwei Sun (Chandler, Ariz.) and Babita Dhayal (Aloha, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members are disclosed. An example semiconductor die disclosed herein includes a semiconductor substrate, metal interconnects proximate a first side of the semiconduct...