US Patent Issued to Intel on Nov. 3 for "Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,778, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates" was invented by Kyle Arrington (Gilbert, Ariz.), Bohan Shan (Chandler, Ariz.), Haobo Chen (Chandler, Ariz.), Ziyin Lin (Chandler, Ariz.), Hongxia Feng (Chandler, Ariz.), Yiqun Bai (Chandler, Ariz.), Dingying Xu (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.), Bai Nie (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, apparatus, and articles of manufacture to...