US Patent Issued to Intel on Nov. 3 for "Memory on package (MOP) architecture" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,861, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Memory on package (MOP) architecture" was invented by Eng Huat Goh (Ayer Itam, Malaysia), Telesphor Kamgaing (Chandler, Ariz.), Chee Kheong Yoon (Bayan Lepas, Malaysia), Jooi Wah Wong (Bukit Mertajam, Malaysia), Min Suet Lim (Gelugor, Malaysia), Kavitha Nagarajan (Bangalore, India) and Chu Aun Lim (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate with a first memory die stack on the package substrate, and a second memory die stack on the...