US Patent Issued to Intel on May 19 for "Semiconductor packages for alternate stacked memory and methods of manufacturing the same" (Malaysian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,565, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor packages for alternate stacked memory and methods of manufacturing the same" was invented by Seok Ling Lim (Kedah, Malaysia), Jenny Shio Yin Ong (Pulau Pinang, Malaysia), Bok Eng Cheah (Pulau Pinang, Malaysia), Jackson Chung Peng Kong (Pulau Pinang, Malaysia) and Kooi Chi Ooi (Pulau Pinang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a silicon die including a first die surface coupled to a package substrate, a second die surface opposite to the first die surface, and at least one die sidewall orthogonal to the first di...