US Patent Issued to Intel on May 19 for "Liquid metal based first level interconnects" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,564, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.).

"Liquid metal based first level interconnects" was invented by Kyle J. Arrington (Gilbert, Ariz.), Karumbu Nathan Meyyappan (Portland, Ore.) and Srikant Nekkanty (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an integrated circuit assembly includes a substrate comprising electrical connectors on a top side of the substrate and an integrated circuit die coupled to the top side of the substrate. The integrated circuit die includes metal pillars extending from a bottom side of the die facing the top side of the substrate, and the metal pillars o...