ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,064, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.).
"High density skip layer transmission line with plated slot" was invented by Carlos Mariscal (Gresham, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus relating to a high density skip layer transmission line with a plated slot are described. In one embodiment, a printed circuit board includes a plurality of transmission lines. A first transmission from the plurality of transmission lines includes a first signal trace and a first ground plane and a first plated slot coupled to a second plated slot via the first ground plane. A ground shield is formed by ...