US Patent Issued to Intel on March 31 for "Covered cavity for a photonic integrated circuit (PIC)" (Arizona, California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,092, issued on March 31, was assigned to Intel Corp. (Santa Clara, Calif.).

"Covered cavity for a photonic integrated circuit (PIC)" was invented by Chia-Pin Chiu (Tempe, Ariz.), Omkar G. Karhade (Chandler, Ariz.), Kaveh Hosseini (Livermore, Calif.), Tim T. Hoang (San Jose, Calif.) and Nitin A. Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Covered cavity structure for Photonic integrated circuits (PICs) that include a micro-ring resonator (MRR) with a heater. Air cavities are etched or otherwise thinned into an overlaying oxide layer, a buried oxide layer, or an underlying silicon layer. Variations in size, shape, and lo...