ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,858, issued on March 3, was assigned to Intel Corp. (Santa Clara, Calif.).
"Secondary die with a ground plane for strip line routing" was invented by Telesphor Kamgaing (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to systems, apparatuses, or processes for packages that include a high-speed transmission line that is routed from a compute die on a substrate under a silicon die that is next to the compute die on the substrate. The silicon die includes a ground plane above the high-speed transmission line. The high-speed transmission line is at least partially between the ground plane of the silicon die and a...