US Patent Issued to Intel on March 3 for "Patternable die attach materials and processes for patterning" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,831, issued on March 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Patternable die attach materials and processes for patterning" was invented by Bai Nie (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Jesse Jones (Chandler, Ariz.), Yosuke Kanaoka (Chandler, Ariz.), Hongxia Feng (Chandler, Ariz.), Dingying Xu (Chandler, Ariz.), Rahul Manepalli (Chandler, Ariz.), Sameer Paital (Chandler, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Yonggang Li (Chandler, Ariz.), Meizi Jiao (Chandler, Ariz.), Chong Zhang (Chandler, Ariz.), Matthew Tingey (Hillsboro, Ore.), Jung Kyu Han (Chandler, Ariz.) and Haobo Chen (Gilbert, Ariz.).

According t...