ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,694, issued on March 3, was assigned to Intel Corp. (Santa Clara, Calif.).
"High density cable structure and wire termination" was invented by Xiang Li (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus relating to a high density cable structure and wire termination are described. In one embodiment, a plug structure includes a paddle card to couple two wires to two gold fingers and a first add-on plug to couple a first wire to a first gold finger. The paddle card and the first add-on plug are to be stacked to form a single plug structure having a first row of gold fingers and a second row of gold fingers. Other embo...