ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,524, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).
"Stacked via modulator in high speed interconnect" was invented by Jiwei Sun (Chandler, Ariz.), Zhiguo Qian (Chandler, Ariz.) and Kemal Aygun (Tempe, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages In an embodiment, the electronic package comprises first substrate layers, and a core under the first substrate layers. In an embodiment, second substrate layers are under the core, and an interconnect is through the first substrate layers, the core, and the second substrate layers. In an embodiment, a portion of the i...