US Patent Issued to Intel on March 24 for "Metal spacers with hard masks formed using a subtractive process" (Oregon Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,493, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metal spacers with hard masks formed using a subtractive process" was invented by Nafees A. Kabir (Hillsboro, Ore.) and Kevin L. Lin (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes a first interconnect layer, and a conductive first interconnect feature and a conductive second interconnect feature laterally separated by a body of insulating or semiconductor material. In an example, the first and second interconnect features are above the first interconnect layer. The integrated circuit device further includes a non-condu...