ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,550, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).
"Integrated circuit interconnect with embedded die" was invented by Santosh Tripathi (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first die and a second die. The second die is embedded or otherwise contained in a layered interconnect structure of the first die. The second die can be an IC die or it can be an electrically inactive element, such as a heat spreader. A portion of the layered interconnect structure is laterally adjacent to the second die. A first part of the second die can be electrically connected to a second p...