US Patent Issued to Intel on March 24 for "Integrated circuit heat spreader including sealant interface material" (Arizona Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,499, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit heat spreader including sealant interface material" was invented by Feras Eid (Chandler, Ariz.), Sergio Antonio Chan Arguedas (Chandler, Ariz.) and Bamidele Daniel Falola (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hybrid integrated heat spreader suitable for an integrated circuit (IC) die package. The hybrid integrated heat spreader includes a top sheet material and a sealant interface material located where the heat spreader is to contact an assembly substrate. The sealant interface material may offer greater adhesion to a sealant...