US Patent Issued to Intel on March 24 for "Antenna package using ball attach array to connect antenna and base substrates" (Arizona Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,906, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Antenna package using ball attach array to connect antenna and base substrates" was invented by Jimin Yao (Chandler, Ariz.), Robert L. Sankman (Phoenix), Shawna M. Liff (Scottsdale, Ariz.), Sri Chaitra Jyotsna Chavali (Chandler, Ariz.), William J. Lambert (Chandler, Ariz.) and Zhichao Zhang (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package h...