US Patent Issued to Intel on March 17 for "Semiconductor devices and methods for forming a semiconductor device" (German Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,929, issued on March 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor devices and methods for forming a semiconductor device" was invented by Georg Seidemann (Landshut, Germany), Martin Ostermayr (Woerth, Germany), Walther Lutz (Erding, Germany) and Joachim Assenmacher (Unterhaching, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided. The semiconductor device comprises a semiconductor die comprising a semiconductor substrate and a plurality of transistors arranged at a front side of the semiconductor substrate. Further, the semiconductor die comprises a first electrically conductive struct...