US Patent Issued to Intel on March 17 for "Methods and apparatus to cool electronic devices" (Indian, Taiwanese, Malaysian, American Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,611, issued on March 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to cool electronic devices" was invented by Jeff Ku (Taipei, Taiwan), Cora Nien (Taipei, Taiwan), Arnab Sen (Bangalore, India), Samarth Alva (Bangalore, India), Boon Ping Koh (Seberang Jaya, Malaysia), Min Suet Lim (Gelugor, Malaysia), Arvind S (Bangalore, India), Lance Lin (Taipei, India), Prakash Kumar Raju (Bangalore, India) and Shantanu Kulkarni (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a f...