US Patent Issued to Intel on March 17 for "Interposer interconnects and enclosure for silicon photonics LIDAR module" (Arizona, California Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,996, issued on March 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interposer interconnects and enclosure for silicon photonics LIDAR module" was invented by Ronald L. Spreitzer (Phoenix), Ankur Agrawal (Chandler, Ariz.), Guiyun Bai (Chandler, Ariz.), Eleanor Patricia Paras Rabadam (Folsom, Calif.) and Sanjeev Gupta (Santa Rosa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electroni...