US Patent Issued to intel on March 17 for "Electrically conductive strips on a side of a memory module" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,972, issued on March 17, was assigned to intel Corp. (Santa Clara, Calif.).

"Electrically conductive strips on a side of a memory module" was invented by Min Suet Lim (Gelugor, Malaysia), Kavitha Nagarajan (Bangalore, India), Eng Huat Goh (Ayer Itam, Malaysia) and Telesphor Kamgaing (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substra...