US Patent Issued to Intel on June 9 for "Vacuum-based attachment for heat sink and radiation shield" (Indian, American Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,786, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Vacuum-based attachment for heat sink and radiation shield" was invented by Samarth Alva (Bangalore, India), Juha Tapani Paavola (Hillsboro, Ore.) and Arnab Sen (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than...