US Patent Issued to Intel on June 9 for "Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,078, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate" was invented by Tin Poay Chuah (Bayan Baru, Malaysia), Jeff Ku (Taipei City, Taiwan), Min Suet Lim (Gelugor, Malaysia), Yew San Lim (Gelugor, Malaysia) and Twan Sing Loo (Butterworth, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Ho...