US Patent Issued to Intel on June 9 for "Inductors for hybrid bonding interconnect architectures" (California, Oregon Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,810, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Inductors for hybrid bonding interconnect architectures" was invented by Qiang Yu (Saratoga, Calif.), Gwang-Soo Kim (Portland, Ore.) and Said Rami (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an apparatus includes a first integrated circuit die with metal bonding pads that are co-planar with an external surface of the die and a second integrated circuit die with metal bonding pads that are co-planar with an external surface of the die. The first and second integrated circuit dies are coupled together such that their external surfaces are in...