US Patent Issued to Intel on June 30 for "Technologies for vertically interconnected glass core architecture" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,564, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Technologies for vertically interconnected glass core architecture" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Brandon Christian Marin (Gilbert, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Technologies for a vertically interconnected glass layer architecture is disclosed. In the illustrative embodiment, an integrated circuit component includes several integrated circuit dies and a glass layer. Integrated circuit dies are positioned both above and bel...