US Patent Issued to Intel on June 30 for "Photonic integrated circuit packaging architectures" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,658, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Photonic integrated circuit packaging architectures" was invented by Omkar G. Karhade (Chandler, Ariz.), Xiaoqian Li (Chandler, Ariz.), Ravindranath Vithal Mahajan (Chandler, Ariz.), Nitin A. Deshpande (Chandler, Ariz.) and Srinivas V. Pietambaram (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has a...