US Patent Issued to Intel on June 30 for "Optical packaging using embedded-in-mold (EIM) optical module integration" (American, Singaporean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,659, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Optical packaging using embedded-in-mold (EIM) optical module integration" was invented by Dowon Kim (Singapore), Suohai Mei (Sunnyvale, Calif.), Pooya Tadayon (Portland, Ore.), Jason Michael Gamba (Gilbert, Ariz.) and Sanka Ganesan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the ph...