US Patent Issued to Intel on June 30 for "Designs of thermal insulation for micro-ring resonator (MRR) in on-cavity pic (OCPIC) to achieve effective thermal tuning" (Arizona, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,644, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Designs of thermal insulation for micro-ring resonator (MRR) in on-cavity pic (OCPIC) to achieve effective thermal tuning" was invented by Chia-Pin Chiu (Tempe, Ariz.), Kaveh Hosseini (Livermore, Calif.) and Omkar Karhade (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment, an optoelectronic system comprises a first substrate, a second substrate over the first substrate, and a micro-ring resonator (MRR) over the second substrate. In an embodiment, a h...