US Patent Issued to Intel on June 30 for "Cavity-less interconnect component on glass core" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,562, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Cavity-less interconnect component on glass core" was invented by Jeremy D. Ecton (Gilbert, Ariz.), Hiroki Tanaka (Gilbert, Ariz.), Brandon Christian Marin (Gilbert, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A glass core with a cavity-less local interconnect component architecture for complex multi-die packages. The apparatus has the local interconnect component attached directly to a planar glass layer and surrounded by mold. One or more redistribution layers may be located above an...