ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,574, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.).
"Multilayer back plate with molded ceramic layer" was invented by Phil Geng (Washougal, Wash.), Ralph V. Miele (Hillsboro, Ore.) and David Shia (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board."
The patent was filed on March 17, 2022, under Application No. 1...