US Patent Issued to Intel on June 23 for "Integrated packaging architecture with solder and non-solder interconnects" (Oregon, Texas, Arizona Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,001, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated packaging architecture with solder and non-solder interconnects" was invented by Jin Yang (Hillsboro, Ore.), David Shia (Portland, Ore.), Adel A. Elsherbini (Tempe, Ariz.), Christopher M. Pelto (Beaverton, Ore.), Kimin Jun (Portland, Ore.), Bradley A. Jackson (Lake Oswego, Ore.), Robert J. Munoz (Round Rock, Texas), Shawna M. Liff (Scottsdale, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pit...