US Patent Issued to Intel on June 23 for "Integrated circuit packages with hybrid bonded dies and methods of manufacturing the same" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,006, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit packages with hybrid bonded dies and methods of manufacturing the same" was invented by Omkar Karhade (Chandler, Ariz.), Nitin Deshpande (Chandler, Ariz.), Harini Kilambi (Portland, Ore.), Jagat Shakya (Hillsboro, Ore.) and Debendra Mallik (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture are disclosed includes an integrated circuit (IC) package including a first die including a first surface and a second surface opposite the first surface, the first surface defined by a bulk semiconduc...