US Patent Issued to Intel on June 23 for "Incorporation of superlattice semi-metals for scaled interconnects" (Oregon Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,956, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Incorporation of superlattice semi-metals for scaled interconnects" was invented by Abhishek Anil Sharma (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an integrated circuit structure. In an embodiment, the integrated circuit structure comprises an interlayer dielectric (ILD). and an interconnect over the ILD. In an embodiment, the interconnect comprises a plurality of first layers, where the first layers comprise a metal, and a plurality of second layer in an alternating pattern with the plurality of first layers. In an e...