US Patent Issued to Intel on June 2 for "Fabrication of gate-all-around integrated circuit structures having additive gate structures" (Oregon Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,180, issued on June 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fabrication of gate-all-around integrated circuit structures having additive gate structures" was invented by Dan S. Lavric (Beaverton, Ore.), YenTing Chiu (Portland, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Gate-all-around integrated circuit structures having additive gate structures are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A P-type gate stack is over the first vertical arrangement of horizonta...