US Patent Issued to Intel on June 16 for "Substrate architecture for enhanced electrostatic chucking" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,680, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrate architecture for enhanced electrostatic chucking" was invented by Aaditya Anand Candadai (Chandler, Ariz.), Nicholas Haehn (Scottsdale, Ariz.), Ao Wang (Chandler, Ariz.), Whitney Bryks (Tempe, Ariz.) and Srinivas Pietambaram (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a semiconductor panel providing a laminated structure and a plurality of electrically isolated structures distributed throughout the laminated structure to increase an attraction between the laminated structure and an electrostatic chuck. In an...