US Patent Issued to Intel on June 16 for "Molded interconnect memory on package" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,645, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Molded interconnect memory on package" was invented by Hazwani Jaffar (Kepala Batas, Malaysia), Poh Boon Khoo (Perai, Malaysia), Hooi San Lam (Air Itam, Malaysia), Jiun Hann Sir (Gelugor, Malaysia) and Eng Huat Goh (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic system includes a first substrate including first solder bumps on a bottom surface, the first solder bumps having a first solder bump surface opposite from the bottom surface; a processor integrated circuit (IC) die including at least one processor mounted on a top surface of the first ...