US Patent Issued to Intel on June 16 for "Embedded glass cores in package substrates and related methods" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,648, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Embedded glass cores in package substrates and related methods" was invented by Jung Kyu Han (Chandler, Ariz.), Jiwei Sun (Chandler, Ariz.), Zhiguo Qian (Chandler, Ariz.) and Srinivas Pietambaram (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second ...