ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,375, issued on July 7, was assigned to Intel Corp. (Santa Clara, Calif.).
"Stepped package and recessed circuit board" was invented by Martin M. Chang (Beaverton, Ore.), Tin Poay Chuah (Bayan Baru, Malaysia), Eng Huat Goh (Ayer Itam, Malaysia), Chu Aun Lim (Hillsboro, Ore.) and Min Suet Lim (Gelugor, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts;...