US Patent Issued to Intel on July 28 for "Active device layer at interconnect interfaces" (Oregon, Arizona, California Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,798, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Active device layer at interconnect interfaces" was invented by Han Wui Then (Portland, Ore.), Adel A. Elsherbini (Tempe, Ariz.), Kimin Jun (Portland, Ore.), Johanna M. Swan (Scottsdale, Ariz.), Shawna M. Liff (Scottsdale, Ariz.), Sathya Narasimman Tiagaraj (San Jose, Calif.), Gerald S. Pasdast (San Jose, Calif.), Aleksandar Aleksov (Chandler, Ariz.) and Feras Eid (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die assembly comprising: a first component layer having conductive through-connections in an insulator, a second component layer comprising a die, a...