US Patent Issued to Intel on July 21 for "Stress-reducing dielectric-to-metal adhesion architecture for electronic packages" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,461, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Stress-reducing dielectric-to-metal adhesion architecture for electronic packages" was invented by Yi Yang (Gilbert, Ariz.), Srinivas Pietambaram (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package comprises a conductive feature over a first surface of a package substrate, the conductive feature to couple to an integrated circuit die; a first dielectric layer on the conductive feature, the first dielectric layer having a first thickness and comprising silicon and nitrogen; a second dielectric lay...