US Patent Issued to Intel on July 21 for "Separable electronics device using a modular connection device" (Indian, Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,884, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Separable electronics device using a modular connection device" was invented by Prakash Kurma Raju (Bangalore, India), Navneet Singh (Bangalore, India), Amruta Ranade (Bangalore, India), Ajmeer Kaja (Bangalore, India) and Jeff Ku (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus, systems, and articles of manufacture for separable electronic devices are disclosed. A separable electronics device includes a first panel having a first zipper component, the first panel including a front housing, display cover glass, a display panel, display electronics, and...